The 3D IC market is projected to grow at a rate of 16.6% in terms of value, from USD 6.48 Billion in 2019 to reach USD 22.30 Billion by 2027.
These ICs find widespread application in telecommunication, consumer electronics military, healthcare, and automotive industries, among others, to cater to the increasing demand to integrate distinct technologies, such as memory, logic gates, radiofrequency, and sensor in miniaturized form for application in industries. Further, the growth of the market is swayed by the surging demand for advanced electronic products with exceptional functionality and small form factor and high demand for 3D packaging deploying TSVs. As the 3D architecture matures, the market is forecasted to witness rapid growth with an increase in innovative 3D projects following advancements in 3D architecture.
Major players in the market include
Samsung Electronics Co. Ltd., Toshiba Corporation, ASE Group, STMicroelectronics, Taiwan Semiconductor Manufacturing Co. Ltd., Intel Corporation, Broadcom Ltd., Amkor Technology, United Microelectronics Corporation, and Xilinx Inc., among others
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Application Outlook (Revenue, USD Million; 2017-2027)
- Memory
- LED
- MEMS
- Sensor
Type Outlook (Revenue, USD Million; 2017-2027)
- 3D Stacked ICs
- True 3D ICs
Industry Verticals Outlook (Revenue, USD Million; 2017-2027)
- IT Telecommunication
- Automotive
- Consumer Electronics
- Military Defense
- Healthcare
- Others
Regional Outlook (Revenue, USD Million; 2017-2027)
- North America
- U.S
- Canada
- Europe
- Germany
- U.K
- France
- Benelux
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia Pacific
- Latin America
- Brazil
- Rest of Latin America
- MEA
- Saudi Arabia
- UAE
- Rest of Middle East and Africa
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